Heliobond is a light-curing, single-component bonding resin for optimizing the enamel-etch technique in combina tion with all light-curing restorative materials (Heliomolar, Helio Progress, Tetric, Tetric EvoCeram, Tetric EvoCeram Bulk Fill).
- Bis-GMA 60 %wt.
- Triethylene glycol dimethacrylate 40 %wt.
- Bonding agent for adhesive restorations
- Transparent sealant for fissures and restorations
- Bonding layer for the repair of resin-, crown-, or bridgework
To achieve an optimum bond to the enamel, the enamel-etch technique (e.g. Total Etch) must be applied. Contamination of the etched and dried enamel surface with saliva or blood will hamper this effect. Phenolic substances (e.g. eugenol) inhibit polymerization. The use of base materials containing these substances must be avoided.
Instructions for use Heliobond
Preparation of enamel
- Depending on the case, bevel enamel surfaces to be treated using a diamond or clean them carefully with an abrasive (e.g. pumice powder and water). Do not use any oily or greasy paste. Possible residue from base materials on the enamel should be removed in this way. Then rinse and dry
- Apply Total Etch on the enamel surfaces to be treated and allow it to react for 15-30 s. Afterwards, carefully rinse with water spray and dry the etched surfaces with a stream of air (use only water- and oil-free air).
- A dry operating field must be ensured. Ideally, a rubber dam should be placed (e.g. OptraDam Plus).
- The etched and dried enamel surface must not be contaminated prior to the application of Heliobond (if the surface comes into contact with saliva or blood, the etching and drying procedures must be repeated).
- Dosage depends on the indication. When used as a bonding agent, a very thin layer of Heliobond should be applied. If necessary, use a stream of air to achieve an optimal thin layer.
- When used as a transparent fissure sealant, Heliobond must be applied using a thicker layer.
Method of application Heliobond
1. Bonding agent for adhesive restorations
- Etch desired enamel surfaces (see preparation of the enamel). If necessary, cover exposed dentin surfaces with Syntac Adhesive (see Syntac instructions for use) or appropriate base material.
- Apply a thin layer of Heliobond onto the etched enamel surface using a brush or spherical instrument.
- An optimal, thin layer can be achieved using a stream of air.
- f used in combination with light-curing luting composites, Heliobond does not require separate polymerization. For direct restorations, separate polymerization of Heliobond is required: Light-cure for 10 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
- Application of the composite.
- Polymerization of the composite.
- Finishing of the restoration.
2. Transparent sealant for fissures and pits
- Etch desired enamel surfaces (see preparation of the enamel)
- Apply Heliobond into the fissures using a suitable instrument or brush. Avoid entrapment of air and wait for approx. 15 s to allow penetration.
- Polymerize with light for 20 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
- After curing, remove inhibited layer. Check occlusion and grind off any excess material.
3. Preparation of resin repair work
– Roughen the smooth resin surfaces.
– If necessary, apply Monobond Plus (see Monobond Plus instructions for use).
– Apply a thin layer of Heliobond (use a stream of air, if necessary).
– Polymerize with light for 10 s using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
– A polymerization time of 10 s is sufficient for thin layers using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
– Thicker layers (e.g. sealings) require 20 s curing time using a light intensity of 500 to 1100 mW/cm2 (e.g. Bluephase).
– The light probe should be held less than 5 mm above the Heliobond surface and should not touch unpolymerized material
– Do not expose Heliobond to intensive light during application since this will significantly shorten the working time.
– If Heliobond is used as a cover layer (e.g. sealant), a thin layer of unpolymerized, sticky material will remain on the surface after polymerization due to the oxygen inhibition. It is recommended to remove this layer with cotton rolls, pellets or by polishing.
- Close bottle immediately after use. Exposure to light may lead to premature polymerization.
- Storage: 2–28 °C / 36–82 °F.
- Do not use Heliobond after the date of expiration.
- Date of expiration: See note on the bottle/packaging.